Functionalizaion of electronic boards by selective laser metalization technology

The electronics market and in more detail the industries related to the PCB (printed circuit boards) fabrication, have detected the need to evolve towards digital manufacturing processes that will give them the chance to confront the needs and requests of their main application sector. In particular, the implementation of digital manufacturing routines allows the companies to offer new electronic devices with customized solutions and with smaller dimensions, providing a fast response to the changing market demands.
Among the different digital technologies used for electronic device manufacturing, the inject printing technology is highlighted as the technology that deposits conductive inks and semiconductive polymers thanks to drop spraying process. Despite the consolidation that this technique of digital manufacturing has acquired, it presents many disadvantages regarding the resolution and repeatability of the details generated. This is why the laser printing techniques are presented as an interesting alternative to the inject printing technology.
In the PRIME-Las project a laser printing process will be developed for PCB fabrication. Particularly, two main laser printing technologies will be studied: laser transfer and laser functionalization. To accomplish the imprint of the conductive tracks of a PCB both transfer and metallization laser techniques will be implemented, while for the deposition of solder points in the PCB only the laser transfer process will be operated.
The ultimate objective of the PRIME-LAS project is to optimize the production methods and the quality of the final products related to the PCB manufacturing market. To achieve this objective three main scientific and technological objectives are suggested. The accomplishment of these objectives will guide the evolution of the project:
a) PCB manufacturing processes based on laser printing techniques: different laser manufacturing processes will be developed to solve the electronic industry current limitations.
b) Validation of the products obtained by laser manufacturing: two main case studies will be presented, relevant for each of the industrial companies involved in the project. The objective will be to validate the quality of the electronic products fabricated by the laser techniques.
c) Study for the implementation of the laser manufacturing processes at an industrial level: several technical and economic studies will be performed to evaluate the feasibility for extrapolating the laser fabrication techniques to the industrial level.
To achieve the suggested objectives the PRIME-LAS project counts on two companies from the electronic industry (Egatel and Star Electrónica) which have great experience in PCB production, as well as great understanding of the current market needs and demands. Aimen Technology Center, with great expertise in advanced laser solutions, in combination with the two companies that represent the electronic industry, will develop several laser fabrication routines for PCB fabrication which will facilitate the miniaturization and customization of the electronic components, as well as achieving a relevant reduction in manufacturing costs and time.
The expertise of the companies along with Aimen’s know-how in the development of laser processes represents a key point for the proper implementation of the PRIME-LAS project.